Chemical Mechanical Planarization of Microelectronic Materials

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This text explains how to use the chemical mechanical planarization (CMP) process to improve the electronic properties of such substances as oxide, tungsten, aluminum, copper...

  • Publisher: John Wiley & Sons
  • Author: Joseph M. Steigerwald
  • ISBN-13: 9780471138273

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Chemical Mechanical Planarization of Microelectronic Materials
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  • ISBN-13:
    • 9780471138273
  • ISBN:
    • 0471138274
  • General
  • Pages
    337
  • Publisher
    John Wiley & Sons
  • Author
    Joseph M. Steigerwald
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